posted on June 05, 2017 11:40
Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise.
View Full Article . . .
Receive pre-event offers for first choice enrollment in seminars and events. Periodic updates on state-of-the-art industry standards and innovations.
The Threshold Network: Join Now!
Advanced CMOS Technology
Fundamentals of Microchip Design and Fabrication
5/3nm FinFET Fabrication
The 3D Packaging Revolution
Advanced Lithography
Remote Learning
Learning Methodology