Warpage Issues in Fan-Out Wafer Level Packaging
posted on July 01, 2017 13:01
As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use the chips first, face-up fan-out wafer level packaging (FOWLP) approach as an example
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