Entries for November 2013
Intel Explains Rare Moore’s Law Stumble?
posted on November 30, 2013 20:50
Intel executives have long showed slides that illustrate its progress in shrinking transistors on chips, featuring nearly identical fever lines as new generations of production technology are perfected. The chart William Holt produced at an analyst meeting Thursday didn’t look right.
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Intel: Competitors Have Given Up ‘Scaling’ Advantage in Moore’s Law
posted on November 30, 2013 20:04
Shares of Intel (INTC) are up 39 cents, or 1.7%, at $24.95., as CEO Brian Krzanich this morning kicks off his first-ever appearance before analysts since taking the helm from Paul Otellini back in May.
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Imec Engineers Form Faster FinFETs From Compound Semiconductors on Silicon Wafer
posted on November 30, 2013 20:03
Construction of compound semiconductor FinFETs on a 300-millimeter silicon wafer shows that the technology could be used for mass production.
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Chip Firms and OEMs to Enjoy Strong Revenue Growth as Year Finishes
posted on November 30, 2013 20:01
Semiconductor companies as well as original equipment manufacturers (OEM) will finish 2013 enjoying significantly higher revenue than when they started out at the beginning of the year, with third- and fourth-quarter inventories anticipated to move briskly for the busy holiday season, according to a Supply Chain Inventory market brief from IHS Inc.
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Are we using Moore’s name in vain?
posted on November 15, 2013 20:05
Clearly Moore’s law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays – transistors) to achieve minimum cost will double every year.
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InGaAs FinFET devices built on CMOS silicon
posted on November 15, 2013 20:04
Imec has announced successful replacement of silicon fins of a CMOS finFET transistor with compound semiconductor material InGaAs fins, so that compound semiconductor (III-V) material based finFETs can be fabricated on a silicon wafer.
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What’s down the road for bulk FinFETs
posted on November 15, 2013 20:03
For the 10nm node and beyond, transistor research efforts are focused on high mobility designs with Ge and III-V channel, reducing VDD supply voltage as well as the subthreshold slope in transistors and optimizing multi-Vt designs.
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Chip Industry tracking toward 450mm production in 2018
posted on November 15, 2013 20:02
Those big, 450-millimeter silicon wafers are finally rising over the chip industry’s horizon.
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TSMC seeing utilization rate of 28nm processes fall
posted on November 15, 2013 20:01
IC foundry Taiwan Semiconductor Manufacturing Company's (TSMC) capacity utilization of its 28nm processes has fallen to 70% due to a slowdown in orders for high-end mobile chips, according to industry sources.
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