Entries for February 2017
IBM Bets on Cognitive Computing
posted on February 20, 2017 11:05
LAS VEGAS—IBM is putting all its chips into the cognitive computing pot at its PartnerWorld Leadership Conference here this week.
View Full Article . . .
Graphene Could Buttress Next-Gen Computer Chip Wiring
posted on February 20, 2017 11:04
Most of the hand-wringing over the fate of Moore’s Law focuses on the ever-shrinking silicon transistor. But increasingly researchers are concerned with another critical part of the infrastructure: the copper wires that connect individual transistors to form complex circuits.
View Full Article . . .
China foundries planning FD-SOI process technology
posted on February 20, 2017 11:03
China-based IC foundries, such as Shanghai Huali Microelectronics (HLMC), are evaluating plans to offer FD-SOI process technology since they are less competitive in the mainstream FinFET segment led by the world's major pure-play foundries and IDMs including Intel, Samsung and TSMC, according to industry sources.
View Full Article . . .
Korean Chip Makers to Increase 3D NAND Flash Facility Investment by 27%
posted on February 20, 2017 11:02
South Korean semiconductor businesses are seeking to take the initiative in the 3D NAND flash market by increasing investment in facilities this year by approximately 30 percent compared to last year. This is to secure technological advantage over other competitors with large preemptive investments.
View Full Article . . .
Using 3D Integration to Get the Heat Out
posted on February 20, 2017 11:01
While the idea has been somewhat scoffed at over the years (who would put LIQUID in ELECTRONICS, after all), it seems that all research roads are currently pointing to liquid cooling as the ideal approach to dealing with hotspots. Ironically, it’s turning out that 3D stacking processes themselves are enabling these cooling approaches to solve the heat and power issues in 3D stacks.
View Full Article . . .
Intel announces $7B investment in next-gen semiconductor fab in Arizona
posted on February 10, 2017 10:05
Intel Corporation yesterday announced plans to invest more than $7 billion to complete Fab 42, a project Intel had previously started and then left vacant. The high-volume factory is in Chandler, Ariz., and is targeted to use the 7 nanometer (nm) manufacturing process.
View Full Article . . .
TSMC, Samsung Diverge at 7nm
posted on February 10, 2017 10:04
SAN FRANCISCO — Samsung and TSMC gave two very different glimpses of their work on 7nm process technology at the International Solid State Circuits Conference (ISSCC) here. Both companies presented work on SRAMs, typically a key driver for next-generation nodes.
View Full Article . . .
More Degrees Of Freedom
posted on February 10, 2017 10:03
Ever since the publication of Gordon Moore’s famous observation in 1965, the semiconductor industry has been laser-focused on shrinking devices to their practical, and more recently, impractical limit.
View Full Article . . .
Betting On Wafer-Level Fan-Outs
posted on February 10, 2017 10:02
Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die.
View Full Article . . .
Apple Watch Dominates as Smartwatches Return to Growth
posted on February 10, 2017 10:01
SAN FRANCISCO—Apple Inc.’s Apple Watch logged 63 percent market share in the fourth quarter of 2016 as the global smartwatch market returned to modest growth after two consecutive quarters of declines, according to market research firm Strategy Analytics.
View Full Article . . .
|
|