Entries for May 2015
3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market
posted on May 26, 2015 10:05
Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.
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Imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects
posted on May 26, 2015 10:04
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.
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Moore’s Law to keep on 28nm
posted on May 26, 2015 10:03
Scaling is now bifurcating – some scaling on with 28/22nm, while other push below 14nm.
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10Nm Fab Watch
posted on May 26, 2015 10:02
When will the 10nm logic node happen?
Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020.
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Intel Orders 15 EUV Lithography Systems
posted on May 26, 2015 10:01
Chip manufacturing equipment supplier ASML Holding NV has received an order for 15 extreme ultraviolet (EUV) lithography systems from an unnamed U.S. customer. The order could be worth in excess of $1 billion.
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