Entries for June 2017
Nvidia CEO Says Moore’s Law Is Dead
posted on June 05, 2017 11:45
TAIPEI — Nvidia CEO Jensen Huang has become the first head of a major semiconductor company to say what academics have been suggesting for some time: Moore’s Law is dead.
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S.Korea chip firms keep upper hand
posted on June 05, 2017 11:44
Electronic device manufacturers in the Chinese mainland see growing demand for semiconductors and displays from South Korea, as local supplies still fall short of demand, industry insiders told the Global Times on Thursday.
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GlobalFoundries aims to double Japan revenue, attack TSMC's market lead
posted on June 05, 2017 11:43
GlobalFoundries, the world's second largest contract chipmaker, aims to double its revenue from Japan over the next few years by launching cheaper chips for newer uses that will help it claw market share from a dominant Taiwanese rival, a senior executive said.
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3DXP's Memory Role Unclear
posted on June 05, 2017 11:42
In integrated circuits, interconnect resistance is a combination of wire and via resistance. Wire resistance of a conductor depends on several factors, one of which is the electron scattering at various surfaces and grain boundaries. Via resistance, on the other hand, is a function of the thickness or resistivity of the layers at the bottom of the via through which current must travel.
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TSMC plans trial production of advanced 5nm process in 2019
posted on June 05, 2017 11:41
TAIPEI, Taiwan -- Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world's largest contract chip maker, is planning to start production of chips made using the sophisticated 5 nanometer process on a trial basis in 2019.
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Samsung Unveils Scaling, Packaging Roadmaps
posted on June 05, 2017 11:40
Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise.
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