Entries for July 2016
Convergence on the Big Five: Focus on Low-cost Flip Chip
posted on July 05, 2016 15:05
Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation.
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Chipmaker Micron to cut jobs after turnaround plans dashed
posted on July 05, 2016 15:04
Memory-chip maker Micron Technology Inc (MU.O) said it would lower costs, including by cutting jobs and focusing on fewer programs, after its hopes of reversing its fortunes this year were thwarted by a persistently challenging market.
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Atomic level precision to extend Moore’s Law
posted on July 05, 2016 15:03
Looking to prolong the ability of the semiconductor industry to follow Moore’s Law, Applied Materials has announced Applied Producer Selectra, said to be an extreme selectivity etch tool that introduces new materials engineering capabilities for continued scaling of 3D logic and memory chips.
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In the space of five years, it looks like 450mm manufacturing has become surplus to current requirements
posted on July 05, 2016 15:02
Five years ago, the semiconductor industry was getting quite excited about what looked like the next step in its evolution. That step was to embrace manufacturing chips on 450mm diameter wafers – and the plans called for 450mm manufacturing to be mainstream today.
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Applied Materials Releases Selective Etch Tool
posted on July 05, 2016 15:01
Applied Materials has disclosed commercial availability of new Selectra(TM) selective etch twin-chamber hardware for the company’s high-volume manufacturing (HVM) Producer® platform.
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