Entries for August 2015
CoolCube Circuit Stacking Moves to FinFET Process
posted on August 15, 2015 15:05
The CEA-Leti research laboratory at Grenoble France, has reported that its CoolCube 3D interconnect technology is suitable for use with FinFET manufacturing processes as well as with fully-depleted silicon-on-insulator manufacturing processes.
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What Will 7Nm And 5Nm Look Like?
posted on August 15, 2015 15:04
Citing an assortment of undisclosed manufacturing issues, Intel in July pushed out the introduction of its 10nm chip and process technology to the second half of 2017. This is roughly six or more months later than expected.
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Intel, Micron Launch "Bulk-Switching" ReRAM
posted on August 15, 2015 15:03
LONDON — Intel Corp. and Micron Technology Inc. have launched a new class of non-volatile memory that they have called 3D Xpoint and which the companies said would be available as samples later this year for special customers.
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Intel and Micron Announce "Revolutionary" Mystery Memory
posted on August 15, 2015 15:02
This week, Intel and Micron announced 3D XPoint (“crosspoint”), a new form of nonvolatile memory that the companies say is 1000 times speedier than NAND Flash and ten times denser than DRAM. But what exactly is it? Good luck trying to figure it out.
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Sultans of shrink pack more chips into smart wearables
posted on August 15, 2015 15:01
The latest chapter in the miniaturisation of increasingly smart consumer electronics lies in the hands of chip packagers, an indispensable group of firms whose role in the supply chain alone is worth $27 billion.
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Applied Materials’ new etch system provides atomic-level precision
posted on August 03, 2015 11:05
Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.
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Imec and Panasonic demonstrate breakthrough RRAM cell
posted on August 03, 2015 11:04
Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability. This breakthrough result paves the way to realizing 28nm embedded applications. The results were presented at this year’s VLSI technology symposium (Kyoto, June 15-19 2015).
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Advanced packaging, 3DICs to figure in SEMICON West discussions
posted on August 03, 2015 11:03
The era of three-dimensional chips is upon us.
At the Design Automation Conference last month in the Moscone Center, I saw a Hybrid Memory Cube in the booth of Open-Silicon in the South Hall. There before me was technology I had read about for years, without witnessing it in person.
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Tackling advanced litho challenges on the path to node 5
posted on August 03, 2015 11:02
If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs. The industry is still concerned with data volumes, whether 193nm immersion or EUVL.
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Etching: A crucial step in semiconductor manufacturing
posted on August 03, 2015 11:01
Plasma etching is a key step in wafer fabrication, from deposition to the patterning of photolithography to dry or wet etch. As such, it is a crucial and hotly-contested area for vendors of semiconductor manufacturing equipment.
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