Entries for August 2017
Ruthenium Liners Give Way To Ruthenium Lines
posted on August 21, 2017 12:05
For several years now, integrated circuit manufacturers have been investigating alternative barrier layer materials for copper interconnects. As interconnect dimensions shrink, the barrier accounts for an increasing fraction of the total line volume. As previously reported, both cobalt and ruthenium have drawn substantial interest because they can serve as both barrier and seed layers, minimizing the amount of high resistance material required.
View Full Article . . .
What Is Spin Torque MRAM?
posted on August 21, 2017 12:04
Everspin’s CEO drills down into new memory types, why and where they’re needed, and why it’s so hard to develop them.
View Full Article . . .
Overcoming challenges in 3D NAND volume manufacturing
posted on August 21, 2017 12:03
Since its introduction several years ago, 3D NAND has become a mainstream technology because of its ability to increase bit density in memory devices. Its adoption has been accelerated by advances in the underlying manufacturing processes that are enabling 3D architectures and lowering the cost per bit. With all its advantages, however, the overall complexity and capital intensity of 3D NAND manufacturing add significantly to the challenges fabs are facing in terms of process control, yield, and economics.
View Full Article . . .
Samsung Promises 2018 Tbit NAND
posted on August 21, 2017 12:02
SAN JOSE, Calif. — Samsung sketched out plans for a terabit 3D-NAND chip that it will ship next year as well as dense solid-state drives using its current chips. It also said that it is sampling the Z-NAND products that it announced last year at latency levels that match or beat Intel’s 3DXP memories.
View Full Article . . .
Silicon wafer shortage starts in 2018
posted on August 21, 2017 12:01
TECHCET CA, an advisory service firm providing electronic materials information, today announced that the silicon wafer supply for semiconductor device fabrication is forecasted to appreciably lag demand starting next year, and could remain in shortage through the year 2021 despite investments in China. Silicon wafer area demand is forecasted to steadily increase at a CAGR of ~3.1% over the 2016-2021 period to reach over 13,000 million square inches (MSI).
View Full Article . . .
|
|