Entries for September 2016
Moore’s Law did indeed stop at 28nm
posted on September 20, 2016 13:05
As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.
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Global Foundries plans multibillion-dollar investment at Fab 8
posted on September 20, 2016 13:04
MALTA — GlobalFoundries announced Thursday it plans a multibillion-dollar investment at its Fab 8 computer chip factory in Malta to start making next generation 7-nanometer chips for customers.
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GF Debuts 7nm, Embedded MRAM
posted on September 20, 2016 13:03
SANTA CLARA, Calif. – Globalfoundries announced plans for a 7nm FinFET process that can deliver chips with up to 30% more performance or 60% less power consumption than its current 14nm node. The process will be in production in late 2018, delivering fin pitches "getting down into the 30nm range," initially using only today’s optical lithography.
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7Nm Market Heats Up
posted on September 20, 2016 13:02
The 7nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes.
Not long ago, TSMC announced plans to enter the 7nm finFET market. In addition, Intel and Samsung are also separately planning to enter the 7nm finFET race.
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Intel will be at 10nm for many years
posted on September 20, 2016 13:01
For more than a decade, Intel was driven by a "tick/tock" development model. The "tick" took place one year and was a manufacturing process shrink, from 45nm to 32nm, for example. The "tock," which took place one year later, was a whole new microarchitecture, such as Penryn to Nehalem.
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3D-NAND Deposition and Etch Integration
posted on September 13, 2016 15:05
3D-NAND chips are in production or pilot-line manufacturing at all major memory manufacturers, and they are expected to rapidly replace most 2D-NAND chips in most applications due to lower costs and greater reliability.
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Globalfoundries Preps 12nm FDSOI Process
posted on September 13, 2016 15:04
Globalfoundries Inc. has announced a next-generation FDSOI process to follow on from the 22FDX process that is nearing production. The company has also announced the presence of EDA and IP companies Cadence and Synopsys within the FDXelerator ecosystem development program for FDSOI.
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TSMC expects 10% in revenue growth
posted on September 13, 2016 15:03
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), which supplies processors for Apple Inc’s iPhones, expects its revenue for this year to grow by nearly 10 percent from a year earlier on smartphone demand.
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TSMC is Confident in their Superior 7nm Chips Being Ready for the 2018 iPhone
posted on September 13, 2016 15:02
In July Patently Apple reported that TSMC had landed an exclusive deal for Apple's 2017 A11, 10nm FinFET processor and noted in that report that the next war with Samsung would be for Apple's business for next-gen 7nm processors for the 2018 iPhone.
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Intel Debuts 14nm+ Processors
posted on September 13, 2016 15:01
SAN JOSE, Calif. – Intel Corp. officially announced Kaby Lake, its seventh-generation Core PC processors made in a 14nm+ process and focused on delivering better 4K video. The family provides the first indication of what more modest product advances may look like as Intel stretches Moore’s law to cover with one process node multiple generations of chips.
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