Entries for September 2017
DARPA’s ICECool Chills 3-D Stacks
posted on September 01, 2017 17:05
LAKE WALES, Fla. — The Defense Advanced Research Projects Agency’s Intrachip/Interchip Enhanced Cooling (ICECool) program, which teamed IBM and the Georgia Institute of Technology to solve the liquid cooling problem for 3-D chip stacks, has yielded an approach that uses an insulating dielectric refrigerant instead of water.
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Taiwan's blackout spooks Apple suppliers
posted on September 01, 2017 17:04
Apple suppliers in export-reliant Taiwan are expressing concerns about the island's power supply after a massive blackout, raising further questions over whether President Tsai Ing-wen's administration is capable of meeting the investment demands of the tech sector, a key driver of the economy.
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Apple Is in Talks With Bain for Toshiba Chips Business
posted on September 01, 2017 17:03
Apple Inc. is wading into the middle of the battle for Toshiba Corp.’s memory chips business.
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Intel Can Now Mesh Different Process Nodes on the Same Chip
posted on September 01, 2017 17:02
One constant of CPU manufacturing for decades has been that different components on the same die must share a common process node. It’s certainly possible to build a package that combines, say, a 14nm CPU with a large pool of on-chip cache built at 22nm, or to have a CPU built at one process node that has a GPU built at a different process node adjacent to it, but on the same physical piece of silicon. Intel has used both approaches in the past.
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Samsung Electronics to invest $7 billion to boost China NAND chip output
posted on September 01, 2017 17:01
SEOUL (Reuters) - Samsung Electronics Co Ltd expects to invest $7 billion over the next three years to expand its NAND memory chip production in China’s northwestern city of Xi‘an, the South Korean tech giant said on Monday.
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