Worst-Case Results Causing Problems
posted on March 14, 2017 16:03
The ability of design tools to identify worst-case scenarios has allowed many chipmakers to flag potential issues well ahead of tapeout, but as process geometries shrink that approach is beginning to create its own set of issues.
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Wikileaks' CIA hacking dump sends tech firms scrambling for fixes
posted on March 14, 2017 16:02
Tech companies must rapidly step up information-sharing to protect users from prying eyes, a security software executive said on Wednesday after WikiLeaks released a trove of data purporting to show that the CIA can hack all manner of devices.
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Record Spending for Fab Equipment Expected in 2017 and 2018
posted on March 14, 2017 16:01
MILPITAS, Calif. – March 7, 2017 – Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017. The record is expected to be broken again in 2018, nearing the $50 billion mark. These record-busting years are part of three consecutive years of growth (2016, 2017 and 2018), which has not occurred since the mid-1990s. The report has been the industry’s most trusted data source for 24 years, observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide. See Figure 1.
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What Does An AI Chip Look Like?
posted on March 05, 2017 16:05
As the market for artificial intelligence heats up, so does confusion about how to build these systems.
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Foundry 10nm yield rates still unsatisfactory
posted on March 05, 2017 16:04
Unsatisfactory yield rates for foundries' 10nm FinFET technologies have pushed back smartphone SoC suppliers' schedules to ship their next-generation products, according to industry sources.
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ASML Revs EUV Engines
posted on March 05, 2017 16:03
SAN JOSE, Calif. — ASML unveiled the NXE:3400B, the extreme ultraviolet lithography scanner that it hopes makes it into volume-production fabs, and gave the first close-up look at its follow-on. At the same event, Carl Zeiss and Samsung described high-resolution systems to inspect masks at the same wavelength as EUV light.
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EUV Progress, Hurdles Cited
posted on March 05, 2017 16:02
SAN JOSE, Calif. — Extreme ultraviolet (EUV) lithography is making significant progress, according to talks from Intel and Samsung specialists at an annual event here. But enough hurdles remain to prevent either company making public commitments about when it will start using the technology.
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UMC Begins Mass Production of 14nm
posted on March 05, 2017 16:01
SAN FRANCISCO—Taiwanese foundry United Microelectronics Corp. has initiated mass production of 14nm chips using its 14nm FinFET technology, the company said Thursday (Feb. 23)
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IBM Bets on Cognitive Computing
posted on February 20, 2017 11:05
LAS VEGAS—IBM is putting all its chips into the cognitive computing pot at its PartnerWorld Leadership Conference here this week.
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Graphene Could Buttress Next-Gen Computer Chip Wiring
posted on February 20, 2017 11:04
Most of the hand-wringing over the fate of Moore’s Law focuses on the ever-shrinking silicon transistor. But increasingly researchers are concerned with another critical part of the infrastructure: the copper wires that connect individual transistors to form complex circuits.
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