Intel Drives New Bus for Future Chiplets
posted on July 27, 2018 16:05
At DARPA’s Electronics Resurgence Initiative Summit, speaker after speaker agreed that the chiplets are coming. Instead of building complex systems-on-chip as one piece of silicon, as is done today, future systems will be made of smaller, cheaper, independently designed component chips bound together on a larger slice of silicon by high-bandwidth interconnects.
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