FTLE 421: Intel Showcases Co-EMIB Advanced Packaging Architecture
posted on August 12, 2019 15:02
Building on their previous announcements of its embedded interconnect bridge, EMIB, ( see IFTLE 324 “Intel EMIB Implementation in the Stratix MX”) and Foveros technologies (see IFTLE 400 “Intel Logic-Logic 3DIC and Chiplets are Finally Here”), Intel, as a prequel to SEMICON West this year, hosted a media/analyst event to provide details on its three new enabling technologies for advanced packaging: Co-EMIB (using EMIB and Foveros together), managed data input/output (MDIO) and Omni-directional interconnect (ODI).
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