IFTLE 127: TSMC’s Next-Gen 3D Technology – N3XT
posted on October 15, 2019 15:04
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC gave a presentation entitled “What Will the Next Node Offer Us?” where he discusses the use of chiplets, 3DICs, and a futuristic technology for the heterogeneous integration of memory and logic called N3XT, noting that this technology will be necessary after 3D in order to combine multiple layers of logic and memory with dense TSVs.
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