posted on August 10, 2022 08:01
SK Hynix has announced the development of its 238-layer 4D NAND flash memory, with shipments of 512Gb triple-level cell (TLC) chip samples already kicking off.SK Hynix expects to enter mass production of 238-layer 512Gb TLC 4D NAND flash chips in the first half of 2023.
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