Entries for August 2013
Advancing resistive memory to improve portable electronics
posted on August 15, 2013 03:35
A team at the University of California, Riverside Bourns College of Engineering has developed a novel way to build what many see as the next generation memory storage devices for portable electronic devices including smart phones, tablets, laptops and digital cameras.
View Full Article . . .
Rolith successfully demonstrates ITO-alternative technology based on rolling mask lithography
posted on August 15, 2013 02:34
Rolith, Inc., a developer of advanced nanostructured devices, yesterday announced the successful demonstration of Transparent Metal Grid Electrode technology based on its disruptive nanolithography method (Rolling Mask Lithography – RMLTM).
View Full Article . . .
Apple’s shift in chip manufacturing strategy boosts semiconductor foundry business
posted on August 15, 2013 01:33
In an illustration of the massive power it wields in the electronics supply chain, Apple Inc.’s migration of the production of key semiconductors from Samsung to pure-play foundries will single-handedly boost the growth of the chip contract manufacturing market this year.
View Full Article . . .
Sub-10 nm nanotechnology engineering breakthrough is big deal for electronics
posted on August 04, 2013 14:05
University of Akron researchers have developed new materials that function on a nanoscale, which could lead to the creation of lighter laptops, slimmer televisions and crisper smartphone visual displays.
View Full Article . . .
Applied Materials announces the Introduction of an NMOS SiC Epi Tool
posted on August 04, 2013 14:03
.
View Full Article . . .
Still a Tale of Two Paths: Highlights of Lithography Panel from SEMICON West 2013
posted on August 04, 2013 14:02
Currently, both 193 immersion multiple patterning (193i MP) and EUV Lithography (EUVL) are the leading contenders for next generation lithography for the 10 nm node and below.
View Full Article . . .
EUV vs TSV: Which one will become production ready first?
posted on August 04, 2013 14:01
The EUV technology has so far gone through monumental achievements vis-à-vis the incredible tasks of developing the next generation stepper technology. In the case of the TSV it is one of the few cases where the “power point” presentation(s) of the TSV idea are so convincing that it is actually hard to oppose it.
View Full Article . . .
|
|