Entries for November 2017
Samsung's Chip Sales Hit New High
posted on November 21, 2017 13:05
SAN FRANCISCO — South Korea's Samsung Electronics nearly tripled its third-quarter profit, largely on the strength of $17.8 billion in chip sales, a company record for any quarter.
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IoT Gets Wake Up Call from Reaper
posted on November 21, 2017 13:04
Also known as IoT Troop, the Reaper IoT botnet is already two million devices strong and growing, built using software that targets and exploits known IoT device security flaws. IoT botnets use the collected bandwidth of a vast number of compromised IoT devices is utilized by hackers for nefarious purposes that often include distributed denial-of-service (DDoS) attacks.
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IoT May Need Sub-50-Cent SoCs
posted on November 21, 2017 13:03
SANTA CLARA, Calif. — The future of the Internet of Things could depend on a chip that sells for less than 50 cents, according to a panel of technologists at ARM TechCon here. SoCs will need new kinds of memories, connectivity and sensors to scale to dimensions the IoT will demand, but the path to get there is still unclear, they said.
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China Is Starting to Rethink Its Dreams of Chip Domination
posted on November 21, 2017 13:02
China’s signaling a tempering of its ambitions to become a global semiconductor power because it can’t out-spend the likes of Intel Corp. in the short run, but it still intends to become a force in unclaimed fields such as the Internet of Things.
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How to solve the BEOL RC delay problem?
posted on November 21, 2017 13:01
With the 7nm technology node in the development phase and the 5nm node moving into development, transistor scaling gets ever more complex. On top of that, the performance benefits gained at the front-end-of-line (i.e., the transistors) can easily be undone if the back-end-of-line can’t come along. BEOL processing involves the creation of stacked layers of Cu wires that electrically interconnect the transistors in the chip. Today, high-end logic chips easily have 12 to 15 levels of Cu wires.
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iPhone X Costs Apple $370 in Materials, IHS Markit Teardown
posted on November 14, 2017 11:05
LONDON--(BUSINESS WIRE)--Teardown engineers at IHS Markit (Nasdaq: INFO) have completed their preliminary physical dissection of the new Apple iPhone X and found that the model A1865 version of the smartphone with 64 gigabytes (GB) of NAND memory carries a bill of materials (BOM) of $370.25.
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'Historic' AMD Pact Shows Intel's New Reality
posted on November 14, 2017 11:04
SAN FRANCISCO — Intel and AMD — bitter rivals for decades — have partnered on product that integrates an Intel Core processor, a semi-custom Radeon graphics chip and second-generation High Bandwidth Memory into a single processor package.
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Qualcomm sues Apple for breach of software license contract
posted on November 14, 2017 11:03
(Reuters) - Qualcomm Inc (QCOM.O) has sued Apple Inc (AAPL.O), alleging that it violated a software license contract to benefit rival chipmaker Intel Corp (INTC.O) for making broadband modems, the latest salvo in the longstanding dispute between Qualcomm and Apple.
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Apple’s Qualcomm Grudge Runs Deep
posted on November 14, 2017 11:02
The industry is abuzz with speculation that Apple might disdain Qualcomm's 2018-model modem chips. Is Apple pulling all these maneuvers to win the legal fight at all costs?
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Higher DRAM Bit Growth Seen For 2018
posted on November 14, 2017 11:01
SAN FRANCISCO — Tight DRAM supply conditions that have persisted all year long — resulting in a significant boom for suppliers — may come to an end in 2018, as Samsung Electronics ratchets up capacity to extend its lead over competitors and freeze new entrants from China out of the market, according to one market research firm.
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