Entries for December 2019
Scaling, Packaging, And Partitioning
posted on December 19, 2019 10:05
Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing.
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Fab Equipment Spending Crawls Out of Slump in Second Half 2019 – But Roller Coast to Continue in 2020
posted on December 19, 2019 10:04
Global fab equipment spending is slowly crawling out of its slump in the second half of 2019 with a pickup in investments in memory – particularly 3D NAND – leading-edge logic and foundries. Compared to the first half of 2019, the second half smacks of a recovery, with fab equipment spending revised upward to show a stronger 2019 overall in the latest update of the World Fab Forecast report, published by SEMI.
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TSMC’s 5-Nanometer Process on Track for First Half of 2020
posted on December 19, 2019 10:03
“Those who know, know.” That was all that TSMC senior director of advanced technology Geoffrey Yeap would say about the mystery ingredient that helps boost the performance of devices made using the company’s next generation manufacturing process.
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China’s Chip Quest Is All Heart, Not Enough Brain
posted on December 19, 2019 10:02
China has made developing its own chip industry a matter of patriotic pride. It helps that “China chip” and “China heart” sound the same in the local language. The strain of this 1.7 trillion yuan ($243 billion) endeavor may be too much for the debt-clogged arteries of its municipal governments, though.
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Into The Cold And Darkness
posted on December 19, 2019 10:01
The need for speed is limitless. There is far more data to process, and there is competition on a global scale to process it fastest and most efficiently. But how to achieve future revs of improvements will begin to look very different from the past.
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Designing In 4D
posted on December 04, 2019 13:05
Until 16/14nm, most design engineers viewed the world in two dimensions. Circuits were laid out along x and y axes, and everything was packed in between those two borders.
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Samsung on trial: Can top South Korea company stay on course?
posted on December 04, 2019 13:04
SEOUL -- Things looked bright for Samsung Electronics in 2016. The company had just announced South Korea's biggest-ever corporate takeover. Halfway around the world the future U.S. president was also using a Galaxy smartphone to tweet scathing attacks against the company's archrival Apple.
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The Fight Over Encrypted DNS: Explained
posted on December 04, 2019 13:03
Privacy and security specialists are in the middle of a very public fight over the future of Internet encryption.
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A Semiconductor Slump Will Send Shockwaves Across the Sector
posted on December 04, 2019 13:02
For two years, strong demand and favorable pricing sent sales of semiconductors soaring: In 2017 and 2018, the global semiconductor industry saw revenue jump by 21.6% and 13.7%, respectively.
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Is There A Crossover Point For Mainstream Anymore?
posted on December 04, 2019 13:01
Until 28nm, it was generally assumed that process nodes would go mainstream one or two generations after they were introduced. So by the time the leading edge chips for smartphones and servers were being developed at 16/14nm and 10/7nm, it was assumed that developing a chip at 28nm would be less expensive, less complex, and that the process rule deck would shrink.
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