Entries for March 2017
Patterning Problems Pile Up
posted on March 22, 2017 07:05
Chipmakers are ramping up 16nm/14nm finFET processes, with 10nm and 7nm now moving into early production. But at 10nm and beyond, chipmakers are running into a new set of problems.
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TSMC still considering plans for 3nm chip production
posted on March 22, 2017 07:04
Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world's largest contract chip maker, said Monday that its plan to invest in an advanced 3 nanometer process remained under consideration.
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TSMC says to decide on U.S. chip plant next year
posted on March 22, 2017 07:03
Taiwan's TSMC, the world's largest contract chipmaker and a major Apple Inc supplier, on Monday said it would take a decision next year on whether to build a U.S. chip plant.
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Intel Boots Drives with 3D XPoint
posted on March 22, 2017 07:02
FOLSOM, Calif. — Intel Corp. announced its first solid-state drives using its 3D XPoint memory chips. The Optane SSDs are expected to establish a small, but significant, beachhead for the technology, which is one of several alternatives pioneering a new market between flash and DRAM chips.
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TSMC Tips 7+, 12, 22nm Nodes
posted on March 22, 2017 07:01
SANTA CLARA, Calif. — Trying to cover the waterfront, TSMC disclosed plans for new high-, mid- and low-end processes at an annual event here. They included an enhanced 7nm FinFET node using extreme ultraviolet lithography, a 12nm upgrade of its 16nm process and a 22nm planar technology — its answer to fully depleted silicon-on-insulator (FD-SOI).
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Power, Performance And Electronic Surveillance
posted on March 14, 2017 16:05
Stopping governments from listening to your conversations at home will require much more power-hungry and sophisticated devices.
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Intel Facing Huge Challenge In Fast-Growing Market
posted on March 14, 2017 16:04
By some analysts' accounts, /react-text react-text: 214 Intel /react-text react-text: 215 controls close to 99% of the market for microchips used in servers. The current domination is partly based on Intel's innovations and savvy marketing skills, as well as on missteps by competitors.
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Worst-Case Results Causing Problems
posted on March 14, 2017 16:03
The ability of design tools to identify worst-case scenarios has allowed many chipmakers to flag potential issues well ahead of tapeout, but as process geometries shrink that approach is beginning to create its own set of issues.
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Wikileaks' CIA hacking dump sends tech firms scrambling for fixes
posted on March 14, 2017 16:02
Tech companies must rapidly step up information-sharing to protect users from prying eyes, a security software executive said on Wednesday after WikiLeaks released a trove of data purporting to show that the CIA can hack all manner of devices.
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Record Spending for Fab Equipment Expected in 2017 and 2018
posted on March 14, 2017 16:01
MILPITAS, Calif. – March 7, 2017 – Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017. The record is expected to be broken again in 2018, nearing the $50 billion mark. These record-busting years are part of three consecutive years of growth (2016, 2017 and 2018), which has not occurred since the mid-1990s. The report has been the industry’s most trusted data source for 24 years, observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide. See Figure 1.
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