Entries for May 2017
Views of the Silicon Roadmap
posted on May 25, 2017 15:05
ANTWERP, Belgium — The semiconductor road map that An Steegen is showing this year has a new node in the upper right hand corner — 14 Å. The placeholder for a 14-angstrom process — a 0.7x shrink from a 2-nm node in 2025 — is a sign of the unflagging optimism of the veteran process technology expert at the Imec research institute
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The Race To 10/7nm
posted on May 25, 2017 15:04
Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies.
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Global Foundaries says EUV Production in 2019
posted on May 25, 2017 15:03
Globalfoundries will introduce 7nm FinFET production using optical immersion lithography with tape outs expected in the first quarter of 2018, according to Gary Patton, chief technology officer of the foundry.
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Making Interconnects Faster
posted on May 25, 2017 15:02
In integrated circuits, interconnect resistance is a combination of wire and via resistance. Wire resistance of a conductor depends on several factors, one of which is the electron scattering at various surfaces and grain boundaries. Via resistance, on the other hand, is a function of the thickness or resistivity of the layers at the bottom of the via through which current must travel.
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Extending EUV Beyond 3nm
posted on May 25, 2017 15:01
Now that EUV is finally shipping, companies are working on extending it much further using anamorphic lenses and high numerical aperture technology.
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