Entries for July 2018
Intel Drives New Bus for Future Chiplets
posted on July 27, 2018 16:05
At DARPA’s Electronics Resurgence Initiative Summit, speaker after speaker agreed that the chiplets are coming. Instead of building complex systems-on-chip as one piece of silicon, as is done today, future systems will be made of smaller, cheaper, independently designed component chips bound together on a larger slice of silicon by high-bandwidth interconnects.
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Internet of Things as Easy as Sticking Nanoelectronics on Objects
posted on July 27, 2018 16:04
The Internet of Things (IoT), the interconnection of billions of objects and devices that will be communicating with each other, has been the topic of many futurists’ projections. However, getting the engineering sorted out with the aim of fully realizing the myriad visions for IoT is another story.
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China Kills Qualcomm-NXP Deal
posted on July 27, 2018 16:03
SAN FRANCISCO — Qualcomm terminated its agreement to acquire European chip vendor NXP Semiconductors for $44 billion after the deadline to complete the deal passed Wednesday without approval from China's Ministry of Commerce.
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DRAM industry likely to face oversupply in 2019
posted on July 27, 2018 16:02
While the global DRAM market still remains robust currently, the recent capacity ramps by Micron Technology and the planned kick-off of commercial production by China-based Fujian Jin Hua Integrated Circuit and Innotron Memory (previously known as Hefei ChangXin) could lead to oversupply for the memory in 2019, according to industry sources.
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AI is the New Killer-app for Semiconductors
posted on July 27, 2018 16:01
SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be the core technologies for a wide range of new applications.
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Transforming the Fan-out Landscape
posted on July 04, 2018 08:05
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application that put FO on the map and into high volume manufacturing.
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A Path to Broad AI: 5 Challenges
posted on July 04, 2018 08:04
SAN FRANCISCO — Try to find a technology conference or trade show where everybody is not talking about artificial intelligence. Go ahead: Try. But not at this week’s Design Automation Conference (DAC).
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Why Krzanich Had to Go
posted on July 04, 2018 08:03
It's unconscionable for a CEO to be so oblivious of his own power that he cannot imagine how his every word and action affects the people who answer to him.
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A U.S. Machine Recaptures the Supercomputing Crown
posted on July 04, 2018 08:02
Today, U.S. supercomputer advocates are cheering, because for the first time since 2012, a U.S. supercomputer—Oak Ridge National Laboratory’s newly installed Summit supercomputer—has been ranked #1 in performance, capturing the world crown back from China in the twice-yearly TOP500 assessment of supercomputers, which was announced at the ISC High Performance conference in Frankfurt.
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Global Semiconductor Sales in May Increase 21 Percent Year-to-Year
posted on July 04, 2018 08:01
WASHINGTON—July 2, 2018—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $38.7 billion for the month of May 2018, an increase of 21.0 percent compared to the May 2017 total of $32.0 billion.
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