Why Car? Here’s What We Think Apple Wants from ‘iCar
posted on December 31, 2020 05:05
According to a report from Reuters, Apple is targeting production of a passenger car starting in 2024. Rumors of the “iCar”, also known as Project Titan, have been circulating and recirculating for years, but its time may have finally come. Let’s look at that idea in more detail.
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A Glimpse of IEDM 2020
posted on December 31, 2020 04:04
The IEDM conference always has a great display of leading-edge technology in the papers, but I always find a great balance of research and development projects, leading-edge, and mainstream technologies at the conference. Over the years, I focused primarily on leading-edge technologies in both mainstream memory and logic, to help determine forecasts, and to help my clients understand what technologies might be coming down the road that they should either prepare for or have a development project already in place.
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Variation Threat In Advanced Nodes, Packages Grows
posted on December 31, 2020 03:03
Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems.
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Looming 'chip super-cycle' to hike prices benefiting Samsung, SK
posted on December 31, 2020 02:02
With the stay-at-home lifestyle now established throughout the world as people seek shelter from the COVID-19 pandemic, Korea's foundry and memory chip businesses are seeing explosive chip demand, industry analysts said Tuesday.
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Chip giants Intel and Nvidia face new threats from Amazon to Google to Apple
posted on December 31, 2020 01:01
The world’s largest semiconductor companies face a growing competitive threat: their biggest customers making their own chips tailored to the supercharged areas of cloud-computing and artificial intelligence.
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Slower Metal Bogs Down SoC Performance
posted on October 18, 2020 04:05
Metal interconnect delays are rising, offsetting some of the gains from faster transistors at each successive process node.
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IFTLE 464: TSMC’s Family of Packaging Technologies Create 3D Fabric
posted on October 18, 2020 04:04
TSMC recently held its 26th annual Technology Symposium, so let’s take a look at the highlights of their presentations focusing on their advanced packaging activities featuring a new concept called 3D fabric.
Process Control and Inspection for High-Value Advanced Packages: It’s Complicated
posted on October 18, 2020 04:03
In September of 2018, I spoke with KLA’s Stephen Hiebert and Pieter Vandewalle about the changing advanced packaging landscape, and the need for better process control that inspired the company’s foray into the advanced packaging space.
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TSMC raises revenue forecast, citing robust 5G demand
posted on October 18, 2020 04:02
While next-generation smartphones feature more semiconductors and vendors increase their inventory, the chipmaker remains focused on production in Taiwan.
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China’s semiconductor quest is likely to fail, leaving rapprochement with US the only way out
posted on October 18, 2020 04:01
One of the biggest battles in the ongoing US China tech war is over semiconductors – the enabling technology behind everything from smartphones to earth-orbiting satellites.
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