Huawei chip mission shows Taiwan economy gaining from trade war
posted on November 16, 2019 16:05
TAIPEI -- A small group of high-ranking Huawei executives went to Taiwan last month on a mission to ensure that a crucial supplier could continue delivering cutting-edge chips to the Chinese tech giant amid the protracted trade war between Beijing and Washington.
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China lags far behind in semiconductor battle
posted on November 16, 2019 16:04
TAIPEI (Taiwan News) — China is lagging behind in its quest to become a global leader in the semiconductor industry, said Chairman Zhao Weiguo (趙偉國) of China’s state-run semiconductor maker Tsinghua Unigroup.
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China's top chip maker urges U.S. firms to help ease tensions
posted on November 16, 2019 16:03
BEIJING (Reuters) - The head of China’s top state-run semiconductor maker, Tsinghua Unigroup Ltd, called on U.S. companies to “do better” in efforts to overcome China-U.S. tech tensions given they continue to profit from the Chinese market.
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IBM’s DRAM inventor Bob Dennard gets chip industry’s highest honor
posted on November 16, 2019 16:02
If you’re using anything electronic, from a smartphone to a laptop, you’re using Robert Dennard‘s fundamental invention: the single-cell dynamic random access memory chip.
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Inspecting, Patterning EUV Masks
posted on November 16, 2019 16:01
EUV mask inspection is a critical part of the mask making process for extreme ultraviolet (EUV) lithography. During the process flow, defects or particles can crop up on the EUV mask. If the defects aren’t found and removed, the defect image may print on the wafer, thereby impacting chip yields or causing failures.
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X-Ray Tech Lays Chip Secrets Bare
posted on October 15, 2019 15:05
Scientists and engineers in Switzerland and California have come up with a technique that can reveal the 3D design of a modern microprocessor without destroying it.
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IFTLE 127: TSMC’s Next-Gen 3D Technology – N3XT
posted on October 15, 2019 15:04
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC gave a presentation entitled “What Will the Next Node Offer Us?” where he discusses the use of chiplets, 3DICs, and a futuristic technology for the heterogeneous integration of memory and logic called N3XT, noting that this technology will be necessary after 3D in order to combine multiple layers of logic and memory with dense TSVs.
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Chipmakers Are in the Driver’s Seat of Asia’s Tech Rally
posted on October 15, 2019 15:03
Bucking all the doom and gloom in the global chip sector, semiconductor stocks have been the biggest drivers behind an outperformance of Asia’s technology sector this year. And for some market participants it isn’t over yet.
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Side Channel Attacks
posted on October 15, 2019 15:02
Side-channel attacks are a class of attacks where an attacker attempts to assess the state of a cryptographic device and its contents.
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Microsize Lens Pushes Photonics Closer to an On-Chip Future
posted on October 15, 2019 15:01
Optical microcomputing, next-generation compact LiDAR units, and on-chip spectrometers all took a step closer to reality with the recent announcement of a new kind of optical lens.
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