The peaks and valleys of silicon
posted on July 01, 2015 10:04
When the new iPhone came out, customers complained that it could be bent — but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.
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The Future Of Moore’s Law
posted on July 01, 2015 10:03
Semiconductor Engineering sat down to discuss the future of Moore’s Law with Jan Rabaey, Donald O. Pederson distinguished professor at University of California at Berkeley; Lucio Lanza, managing director of Lanza techVentures; Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Charlie Cheng, CEO of Kilopass Technology; Mike Gianfagna, vice president of marketing at eSilicon; and Ron Moore, vice president of marketing for the physical IP division at ARM.
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Tear Down The Wall Between Front-End And Back-End Teams
posted on July 01, 2015 10:02
As complexity of system-on-chip devices increases, it’s becoming imperative for design teams and organizations to re-examine how they work with one another in order to improve productivity. One giant step in this direction is to bridge the divide between the front-end design process and the physical back-end design process.
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The Computer Chip That Never Forgets
posted on July 01, 2015 10:01
In 1945, mathematician John von Neumann wrote down a very simple recipe for a computer. It would contain two key components: a central processing unit to perform calculations and logical operations, and a memory bank to store instructions and data.
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Foundries Expand Planar Efforts
posted on June 20, 2015 18:05
Competition is heating up in the leading-edge foundry business, as vendors begin to ramp up their new 16nm/14nm finFET processes
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Is EUV Making Progress?
posted on June 20, 2015 18:04
EUV has been promised for a couple of decades, counted on for at least three process nodes on the ITRS roadmap, and considered essential to chip manufacturing since 22nm. Billions of dollars have been invested in R&D, engineering teams from around the world have contributed to its development, and still serious problems persist.
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Samsung to put 10nm chips into mass production by end of 2016
posted on June 20, 2015 18:03
Samsung Semiconductor on Thursday announced that it will have 10-nanometer FinFET chips in volume production by the end of next year.
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IHS Says Ramifications of Moore’s Law Lead to Trillions of Dollars Added to the Global Economy
posted on June 20, 2015 18:02
EL SEGUNDO, Calif.--(BUSINESS WIRE)--From connectivity to globalization and sustainability, the “Law” created by Gordon Moore’s prediction for the pace of semiconductor technology advances has set the stage for global technology innovation and contribution for 50 years
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AMD Beats Nvidia to 2.5-D Graphics
posted on June 20, 2015 18:01
AMD beat archrival Nvidia to the goal of rolling out high-end graphics cards that use DRAM chip stacks to provide more memory bandwidth — and thus performance — on relatively small, low-power boards.
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“Easy Does It” ─ Fabs Trim Spending Plans
posted on June 15, 2015 12:05
Semiconductor capital expenditures (without fabless and backend) are expected to slow in rate, but continue to grow by 5.8 percent in 2015 (over US$66 billion) and 2.5 percent in 2016 (over $68 billion), according to the May update of the SEMI World Fab Forecast report. A significant part of this capex is fab equipment spending.
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