The Murky Origins of "Moore's Law"
posted on April 29, 2015 19:04
When I called up Carver Mead in preparation for the 50th anniversary of Moore’s Law, I was eager to track down a particularly elusive detail: the very first time the term “Moore’s Law” was used.
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Analysis: Applied-Tel Scrap Merger
posted on April 29, 2015 19:03
After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal.
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Intel Orders 15 EUV Lithography Systems
posted on April 29, 2015 19:02
Chip manufacturing equipment supplier ASML Holding NV has received an order for 15 extreme ultraviolet (EUV) lithography systems from an unnamed U.S. customer. The order could be worth in excess of $1 billion.
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Moore’s Law At 50
posted on April 29, 2015 19:01
Moore’s Law turned 50 this week…but not because of Gordon Moore. He observed that the number of transistors crammed onto a piece of silicon was doubling every 18 to 24 months and predicted that would continue to be the case. He was right, but it took many thousands of engineers who created methodologies and tools to automate the design and equipment to manufacture complex chips to make that observation a reality.
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Tiawan world's 2nd-largest fabless IC market share
posted on April 07, 2015 14:05
Taipei, April 5 (CNA) Taiwan had quite impressive performance in integrated circuit (IC) design in 2014, securing 18 percent of the world's fabless IC market share, ranking second behind the United States, according to semiconductor market research company IC Insights.
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CoolCube 3D Goes Monolithic
posted on April 07, 2015 14:04
MONTEREY, Calif. — CoolCube 3D chip designs come from the Laboratoire d'électronique des technologies de l'information (CEA-Leti, Grenoble, France) funded by the French government IBM and many others including Qualcomm specifically for its 3D chip technology. CEA-Leti's goal is to be one of the first licensing entities for monolithic 3D chips.
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IBM Bets $3 Billion on the Internet of Things
posted on April 07, 2015 14:03
IBM sees the huge river of data streaming from Internet-connected smartphones, home appliances, and vehicles as a big business opportunity for the near future. “Big Blue” announced on Monday that it would invest US $3 billion over four years on a new business aimed at helping filter the data coming from the growing swarm of sensor-equipped devices.
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Intel and Micron Move 3-D NAND Into Production
posted on April 07, 2015 14:02
The race to build 3-D memories is starting to heat up.
Last week, Intel and Micron announced they have developed a 3-D NAND memory with 32 layers that they expect to mass produce later this year. (That’s 31 layers more than most flash on the market.)
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The Multiple Lives of Moore’s Law
posted on April 07, 2015 14:01
A half century ago, a young engineer named Gordon E. Moore took a look at his fledgling industry and predicted big things to come in the decade ahead. In a four-page article in the trade magazine Electronics, he foresaw a future with home computers, mobile phones, and automatic control systems for cars. All these wonders, he wrote, would be driven by a steady doubling, year after year, in the number of circuit components that could be economically packed on an integrated chip.
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Issues And Options At 5Nm
posted on March 24, 2015 14:05
While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond.
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