Cypress and Spansion to merge in $4B all-stock transaction
posted on December 23, 2014 18:04
Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually
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Soitec announces new world record for solar cell efficiency at 46%
posted on December 23, 2014 18:03
Soitec and CEA-Leti, along with the Fraunhofer Institute for Solar Energy Systems ISE, announced a new world record for the direct conversion of sunlight into electricity has been established. The record multi-junction solar cell converts 46 % of the solar light into electrical energy.
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EUV Rollout Slowed, 450mm Wafers Halted, Uncertain Path Ahead for Supply Side Economics
posted on December 23, 2014 18:02
In recent times, there is a growing concern about the state of the global semiconductor ecosystem. The entire economic structure that was supposed to lead to next-generation manufacturing technologies like 450mm wafers, extreme ultraviolet (EUV) lithography, and transistor technology nodes below 14nm CMOS is on the verge of coming apart.
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3D TSV begins
posted on December 23, 2014 18:01
3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications (Source: 3DIC & 2.5D TSV Interconnect for Advanced Packaging Business Update report). Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube … have all brought devices to the market that integrate 3D TSV technology.
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IEDM 2014 Preview
posted on December 12, 2014 17:05
In the last few days I’ve gone through the advance program, and here’s my look at what’s coming up, in more or less chronological order. As usual there are overlapping sessions with interesting papers in parallel slots, but we’ll take the decision as to which to attend on the conference floor.
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UPDATE 2-Chipmaker Cypress to buy peer Spansion for $1.59 bln
posted on December 12, 2014 17:04
(Reuters) - Cypress Semiconductor Corp will buy peer Spansion Inc for $1.59 billion in stock, creating a chipmaker with more than $2 billion in annual revenue to help it shrug off weakness in the smartphone market.
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Intel Sees Path to Extend Moore's Law to 7nm
posted on December 12, 2014 17:03
While giving very little detail about its future production plans, Intel used its investor meeting last week to re-emphasize how importantly it views Moore's Law, the statement from co-founder Gordon Moore that chip density will double every two years.
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Applied Materials develops advanced patterning solution for memory devices
posted on December 12, 2014 17:02
Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
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TSV integration is creating growth and significant interest in the equipment and materials industry
posted on December 12, 2014 17:01
“The long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms,” says Yole (Yole Développement) in its latest report, “Equipment & Materials for 3DIC & WLP Applications
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Chip equipment maker ASML sells first next-generation EUV systems
posted on November 27, 2014 08:05
Nov 24 (Reuters) - Dutch semiconductor equipment maker ASML has received its first order for next-generation extreme ultraviolet (EUV) chip etching systems in a deal with Taiwan's TSMC.
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