Chip-Level Optical Interconnect Market Primed for Growth
posted on October 22, 2013 12:04
Analyst firm Communications Industry Researchers (CIR) has released a new report covering the latest developments in optical interconnection at the chip level and the progress in this area that is being made by research teams throughout the world.
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Global Silicon Demand to Slow Down as Year Finishes
posted on October 22, 2013 12:03
Semiconductor manufacturers confronting slowing orders will see demand for silicon taper off as the year comes to a close, according to a new Global Silicon report from IHS Inc.
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EUV is late but on the way for 10nm; DSA is promising
posted on October 22, 2013 12:02
EUV lithography is late, but it is on the way and will be ready for insertion into the 10nm node, which is slated to go into production in late 2015/early 2016. Meanwhile, results from early work into directed self-assembly (DSA) is quite promising.
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Intel stands firm on 450mm; challenged by defects at 14nm
posted on October 22, 2013 12:01
Brian Krzanich, chief executive officer of Intel, said Intel is standing firm on 450mm development (despite rumors to the contrary), during a quarterly conference call with financial analysts. He also blamed defects on a slight push-out of next-generation 14nm technology.
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The Brave New World Of FinFETs
posted on October 16, 2013 10:05
SoCs using 16nm and 14nm finFETs are expected to begin rolling out next year using a 20nm back-end-of-line process. While the initial performance and power numbers are looking very promising, the challenges of designing and building these complex chips are daunting—and there are more problems on the way.
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Future phones and laptops could have speakers made of carbon nanotubes
posted on October 16, 2013 10:04
For the past year, researchers at Tsinghua University in Beijing have been listening to music on a laptop through a pair of unusual earphones. Although the earphones look ordinary, they do not contain the typical metal coil speaker found in most earphones, but rather a chip made of many string-like carbon nanotube (CNT) yarns with grooves etched in them.
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EUV Still Promising on IMEC's Road Map
posted on October 16, 2013 10:03
The view of extreme ultraviolet lithography (EUV) has always been a bit rosy from this part of the world, where it is being born. So it's no surprise that EUV held a relatively sunny spot in an otherwise fairly detailed and balanced semiconductor road map the IMEC research institute showed at an annual press event here.
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GlobalFoundries will equip factory expansion in the spring
posted on October 16, 2013 10:02
GlobalFoundries Inc. will add extra muscle to its computer-chip business by late spring, when it installs machines on its newly enlarged shop floor at its factory in Saratoga County, NY.
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Samsung launches world's first smartphone with curved screen
posted on October 16, 2013 10:01
Samsung Electronics Co Ltd on Wednesday launched the world's first smartphone with a curved display, a variant of the Galaxy Note which moves the Asian giant a step closer to achieving wearable devices with flexible - even unbreakable - screens.
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Moore’s Law gets very warped in the sub 20nm era
posted on October 08, 2013 11:05
After all the talk of “innovation”, Walden (Wally) Rhines), chairman and CEO of Mentor Graphics, posed many questions about the future of semiconductors in the post 20 nanometre era at IEF2013. He called it the Big Squeeze. Even Gordon Moore reckons that Moore’s Law is at an end. “No exponential is forever,” he said. When asked what he would like his legacy to be, his answer was “anything but Moore’s Law”.
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