3D NAND Production Starts at Samsung
posted on August 19, 2013 02:57
Samsung Electronics Co. Ltd. has begun mass production of a 128 Gbit NAND flash memory that is integrated in multiple layers, and claims that it is the first company to do so.
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Maxim Integrated Products to acquire Volterra Semiconductor Corp
posted on August 19, 2013 01:56
Maxim Integrated Products, Inc. announced it has entered into a definitive agreement to acquire Volterra Semiconductor Corp. for $23 per share, which represents a 55 percent premium to Volterra Semiconductor's closing share price on August 14, 2013. The transaction value is approximately $605 million equity value or $450 million net of Volterra's cash position of approximately $155 million.
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Micron to lay off 5 percent of workforce; Boise impact unknown
posted on August 15, 2013 04:36
Two weeks ago, Micron was celebrating its purchase of a Japanese computer memory company that would make Micron the second-largest memory-chip maker on the planet. Now executives are bracing employees for a 1,500-worker reduction in Micron’s roughly 30,000 employees worldwide during the next 17 months.
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Advancing resistive memory to improve portable electronics
posted on August 15, 2013 03:35
A team at the University of California, Riverside Bourns College of Engineering has developed a novel way to build what many see as the next generation memory storage devices for portable electronic devices including smart phones, tablets, laptops and digital cameras.
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Rolith successfully demonstrates ITO-alternative technology based on rolling mask lithography
posted on August 15, 2013 02:34
Rolith, Inc., a developer of advanced nanostructured devices, yesterday announced the successful demonstration of Transparent Metal Grid Electrode technology based on its disruptive nanolithography method (Rolling Mask Lithography – RMLTM).
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Apple’s shift in chip manufacturing strategy boosts semiconductor foundry business
posted on August 15, 2013 01:33
In an illustration of the massive power it wields in the electronics supply chain, Apple Inc.’s migration of the production of key semiconductors from Samsung to pure-play foundries will single-handedly boost the growth of the chip contract manufacturing market this year.
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Sub-10 nm nanotechnology engineering breakthrough is big deal for electronics
posted on August 04, 2013 14:05
University of Akron researchers have developed new materials that function on a nanoscale, which could lead to the creation of lighter laptops, slimmer televisions and crisper smartphone visual displays.
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Applied Materials announces the Introduction of an NMOS SiC Epi Tool
posted on August 04, 2013 14:03
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Still a Tale of Two Paths: Highlights of Lithography Panel from SEMICON West 2013
posted on August 04, 2013 14:02
Currently, both 193 immersion multiple patterning (193i MP) and EUV Lithography (EUVL) are the leading contenders for next generation lithography for the 10 nm node and below.
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EUV vs TSV: Which one will become production ready first?
posted on August 04, 2013 14:01
The EUV technology has so far gone through monumental achievements vis-à-vis the incredible tasks of developing the next generation stepper technology. In the case of the TSV it is one of the few cases where the “power point” presentation(s) of the TSV idea are so convincing that it is actually hard to oppose it.
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