The Next 5 Years Of Chip Technology
posted on March 22, 2018 09:02
Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies
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Why All Nodes Won’t Work
posted on March 22, 2018 09:01
A flood of new nodes, half-nodes and every number in between is creating confusion among chipmakers. While most say it’s good to have choices, it’s not clear which or how many of those choices are actually good.
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China Is Raising Up to $31.5 Billion to Fuel Chip Vision
posted on March 05, 2018 12:05
China’s government aims to raise as much as 200 billion yuan ($31.5 billion) to invest in homegrown chip companies and accelerate its ambition of building a world-class semiconductor industry, people familiar with the matter said.
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ASML Updates EUV Roadmap
posted on March 05, 2018 12:04
SAN JOSE, Calif. — ASML showed stepwise progress in an update on the performance of its latest extreme ultraviolet (EUV) lithography system and its roadmap at the SPIE Advanced Lithography conference here. The talks showed that getting EUV into production will be a nail-biter, and keeping it useful in the next generation will require multiple field upgrades.
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Engineering in the Twilight of Moore’s Law
posted on March 05, 2018 12:03
I’ve been hearing about the impending end of Moore’s Law for so many years that I’ve become skeptical of all the claims of doom. Like the Little Engine That Could, Moore’s Law keeps chugging along. Nonetheless, it has definitely reached the huffing and puffing stage.
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What EUV Brings To The Table
posted on March 05, 2018 12:02
After many years of hearing that EUV is almost ready for prime time, the tide is finally coming in. A decade of slow but steady progress has resulted in exposure tools that can expose on the order of 1,000 wafers a day on a regular basis. This may be shy of the requirements for high volume manufacturing (HVM), but it is certainly more than enough to support solid development programs and pilot line production.
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Integrated circuit technology advances continue to amaze
posted on March 05, 2018 12:01
The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits.
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Transistor Options Beyond 3nm
posted on February 19, 2018 10:05
Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes.
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Chip Aging Accelerates
posted on February 19, 2018 10:04
Reliability is becoming an increasingly important proof point for new chips as they are rolled out in new markets such as automotive, cloud computing and industrial IoT, but actually proving that a chip will function as expected over time is becoming much more difficult.
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EUV Milestones, Challenges Ahead
posted on February 19, 2018 10:03
EUV lithography faces short-term gains and long-term challenges in resist, actinic inspection, mask and mask pellicles and light sources.
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