Fundamentals of Microchip Design and Fabrication
The introductory course has been newly updated to include all of the latest developments in Microchip Design and Fabrication.
To the uninitiated, microchip technology is a bewildering subject filled with confusing jargon, strange equipment and exotic technology. Indeed, microchip manufacturing is so complex that the engineers involved in the field appear to be speaking an incomprehensible dialect of English that is all their own.
This course demystifies the subject of microchip design and fabrication by presenting a clear and concise overview of the subject in language that can be understood by non-technical personnel. It begins with defining basic electrical principles such as current, voltage and resistance, and then describes how fundamental devices such as transistors, capacitors and diodes function. It then progresses to descriptions of the microchip design process and illustrates the manner in which modern IC circuits are laid-out.
The course next covers CMOS devices (PMOS and NMOS), and digital versus analog circuitry, followed by the presentation of a simplified microchip fabrication sequence and the equipment used in the fabrication process.
Finally, an overview of the packing process is presented and the various types of packing types are described.
The one-and-a half day class is taught in a highly interactive style with key question reviews for each module. In-class exercises are provided, as well as a set of high-quality color notes that are profusely illustrated.
||October 25, 26 (CST)
| Course Length:
Who is the seminar intended for:
- New-hire engineers, technicians, designers, and managers
- Marketing personnel, Sales representatives, Public Relations personnel
- Legal counsel
- Technical Writers
- Tool and Material vendors
- Production personnel, Customer service, and application engineers
- Any employee who requires an overview of microchip design and fabrication
1. Basic Electronics This section of the course explains the fundamentals concepts of electricity and lays the foundation of the rest of the concepts to be presented in later sections of the course.
- Voltage, Current, Resistance
- Electrical circuits, Ohm's Law
- Electrical components (transistors, capacitors, diodes, resistors)
- PN junctions
- Analog versus digital circuits
- Digital Binary Notation
2. Introduction to Microchip Technology The microchip is easily the most important invention in history. It can be used in a seemingly infinite range of applications and appears to have almost magical qualities. This part of the course explains the basics of microchip technology and what microchips are made of and how they work.
- What is an integrated circuit and what are their advantages?
- Why are semiconductor wafers round? How are they made?
- What a transistor is and how it works
- Types of transistors (NMOS, PMOS, CMOS), FinFETs Nanosheets
- Technology Node definition
- Multi-core processors
- Scaling transistors
- High-k dielectrics/strained silicon
3. Overview of Microchip Design Microchip design is as interesting as it is complex. This part of the course presents an overview of the different aspects of microchip design and presents them in a straightforward and easy-to-understand manner. All of the major steps involved in microchip design are explained.
- The microchip family tree: Digital, Analog, Memory, RF, MEMs, Power ICs
- Design considerations: application definition, operating frequency, I/O count, power requirements
- Microchip design tools: EDA, ESL
- Digital Logic, Boolean algebra, RTL generation
- Mask generation, silicon prototype, and debug
- Microchip reliability
4. Overview of Silicon Process technology The tools that make microchip manufacturing possible are amazing pieces of technology. Each different technology type performs a specific and critical task in the manufacturing process and has its own unique characteristics. This part of the course reviews each technology used in the manufacturing process and the role they play in the making of a chip.
- Cleaning technology and clean rooms
- Photolithography, immersion and EUV lithography
- Microelectronic etch
- Atomic Layer Deposition (ALD)
- Epitaxial deposition, function and application
- Chemical and Mechanical Polishing (CMP)
- Chemical Vapor Deposition (CVD)
- Electroplating Copper
- Physical Vapor Deposition (PVD);
- Ion Implantation
- Rapid Thermal Processing (RTP)
5. Overview of Microchip Processing How are microchips actually made? This part of the course demystifies the process of microchip manufacturing through a step-by-step explanation that uses beautiful 3D drawings to illustrate the microchip manufacturing process.
- DIBL - the problem with planar transistors
- The microchip fabrication hierarchy
- Planar transistors versus FinFETs
- FinFETS versus Nanosheets
- The FinFET manufacturing process:
- Well definition, Self-Aligned Double Patterning
- Fin formation and Shallow Trench Isolation
- Gate formation
- Strained Silicon fabrication
- Back-End metallization
Overview of Microchip Packaging Why are microchip packages shaped the way they are and why are there so many different types of microchip packages? This part of the course describes the major types of microchip packages and explains what the relative advantages and disadvantages are of each packaging type.
- The microchip packaging hierarchy
- Separating the microchips from the wafer
- Wire bonding versus solder bumping versus Copper pillars
- The many types of microchip packages:
- Multi-chip modules, System in Package (SiP), System on
Chip (SoC), Package-on Package (PoP), Package-in-
Package (PiP), System in Package (SiP)
- Fan-Out Wafer Level Packaging
- 3D packaging: the concept, the promise and the problems
- A day-and-a-half of instruction by an industry expert with an in-depth understanding of the course material and years of microchip manufacturing experience
- A high quality set of course notes that are in full color.
- A Diploma stating that you have successfully completed the seminar will be mailed to you at the end of the course
Jerry Healey has been a technical professional in the semiconductor industry for 30 years, 8 years of which were spent as a Device Engineer at Motorola SPS (NXP Semiconductor). He was formerly an instructor for UC Berkeley Extension (College of Engineering) and was also employed as a Process Integration Engineer at both Sematech and the Advanced Technology Development Facility (ATDF), where he worked on advanced technology node development.
He is a renowned lecturer in the field of silicon processing, and his areas of expertise include process integration, technology transfer of new processes from R&D into manufacturing, Nanowire and FinFET fabrication. His audiences remember him for the breadth of his knowledge regarding semiconductor manufacturing, his engaging lecture style, and the insightful color graphics he uses to illustrate his lectures.
An award winning public speaker, Mr. Healey has taught numerous courses to thousands of practicing engineers and scientists over the past 15 years. He has also authored numerous papers in the field of silicon processing, and is currently the president of Threshold Systems, a firm that provides consulting services and technical training seminars to the semiconductor industry.