X-Ray Tech Lays Chip Secrets Bare
posted on October 15, 2019 15:05
Scientists and engineers in Switzerland and California have come up with a technique that can reveal the 3D design of a modern microprocessor without destroying it.
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IFTLE 127: TSMC’s Next-Gen 3D Technology – N3XT
posted on October 15, 2019 15:04
Continuing our look out into the future, at the recent Hot Chips Conference, Dr. Phil Wong, VP of R&D at TSMC gave a presentation entitled “What Will the Next Node Offer Us?” where he discusses the use of chiplets, 3DICs, and a futuristic technology for the heterogeneous integration of memory and logic called N3XT, noting that this technology will be necessary after 3D in order to combine multiple layers of logic and memory with dense TSVs.
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Chipmakers Are in the Driver’s Seat of Asia’s Tech Rally
posted on October 15, 2019 15:03
Bucking all the doom and gloom in the global chip sector, semiconductor stocks have been the biggest drivers behind an outperformance of Asia’s technology sector this year. And for some market participants it isn’t over yet.
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Side Channel Attacks
posted on October 15, 2019 15:02
Side-channel attacks are a class of attacks where an attacker attempts to assess the state of a cryptographic device and its contents.
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Microsize Lens Pushes Photonics Closer to an On-Chip Future
posted on October 15, 2019 15:01
Optical microcomputing, next-generation compact LiDAR units, and on-chip spectrometers all took a step closer to reality with the recent announcement of a new kind of optical lens.
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Intel promises bigger, cheaper SSDs for your computer
posted on October 01, 2019 07:05
Solid state drives are way faster than traditional hard drives for storing data on laptops, but they still can't match the old technology when it comes to cost and capacity.
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With EUV, Timing is Everything
posted on October 01, 2019 07:04
EUV is complicated and expensive, but EUV lithography is far more precise at the smallest nodes, and will become necessary. The key will be timing its adoption.
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The Age of the Monster Chip
posted on October 01, 2019 07:03
The complexity of many System-on-Chip (SoC) designs is simply staggering. As an example, this year’s HotChips symposium showcased a variety of new SoC designs for the edge and datacenter that expand our definition of a “big” chip.
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China to overtake Taiwan in chipmaking equipment
posted on October 01, 2019 07:02
China is set to become the world’s largest semiconductor equipment market next year for the first time, outstripping Taiwan, propelled by aggressive equipment investments by Tsinghua Unigroup Ltd (清華紫光) and other Chinese foundry companies, the international trade group SEMI said yesterday.
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Broadcom Says Core Chip Business Has Hit Bottom
posted on October 01, 2019 07:01
Broadcom shares have slipped nearly 5% since the company said on Thursday that its core chip business has bottomed out but was unsure when it will start to recover from the slowdown.
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