Using 3D Integration to Get the Heat Out
posted on February 20, 2017 11:01
While the idea has been somewhat scoffed at over the years (who would put LIQUID in ELECTRONICS, after all), it seems that all research roads are currently pointing to liquid cooling as the ideal approach to dealing with hotspots. Ironically, it’s turning out that 3D stacking processes themselves are enabling these cooling approaches to solve the heat and power issues in 3D stacks.
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