TSMC’s Roadmap Full, But Thin
posted on May 15, 2018 15:03
SANTA CLARA, Calif. — Continuing to move fast in multiple directions at once, TSMC announced that it is in volume production with a 7-nm process and will have a version using extreme ultraviolet (EUV) lithography ramping early next year. In addition, it gave its first timeline for a 5-nm node and announced a half-dozen new packaging options.
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