posted on September 10, 2019 10:03
In the last several years, Intel has had a series of announcements in the packaging arena, focused on the integration of multiple styles of chips in the same package to improve performance and broaden system capabilities.
View Full Article . . .
Receive pre-event offers for first choice enrollment in seminars and events. Periodic updates on state-of-the-art industry standards and innovations.
The Threshold Network: Join Now!
Advanced CMOS Technology
Fundamentals of Microchip Design and Fabrication
5/3nm FinFET Fabrication
The 3D Packaging Revolution
Advanced Lithography
Remote Learning
Learning Methodology