3D TSV begins
posted on December 23, 2014 18:01
3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications (Source: 3DIC & 2.5D TSV Interconnect for Advanced Packaging Business Update report). Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube … have all brought devices to the market that integrate 3D TSV technology.
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