posted on December 26, 2022 09:03
One of the key technologies to enable scaling below 3nm involves delivering of power on the backside of a chip. This novel approach enhances signal integrity and reduces routing congestion, but it also creates some new challenges for which today there are no simple solutions.
View Full Article . . .
Receive pre-event offers for first choice enrollment in seminars and events. Periodic updates on state-of-the-art industry standards and innovations.
The Threshold Network: Join Now!
Advanced CMOS Technology
Fundamentals of Microchip Design and Fabrication
5/3nm FinFET Fabrication
The 3D Packaging Revolution
Advanced Lithography
Remote Learning
Learning Methodology