DARPA’s ICECool Chills 3-D Stacks
posted on September 01, 2017 17:05
LAKE WALES, Fla. — The Defense Advanced Research Projects Agency’s Intrachip/Interchip Enhanced Cooling (ICECool) program, which teamed IBM and the Georgia Institute of Technology to solve the liquid cooling problem for 3-D chip stacks, has yielded an approach that uses an insulating dielectric refrigerant instead of water.
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